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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1CHKEK-002 spec no.: ds20-2007-0208effective date: 11/23/2007revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product C rohs compliant. * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement. * 3.1 mm diameter package. packag e dimensions part no. lens source color ltl1chkek - 002 water clear alingap red notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04 ") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice. part no. : ltl1chkek - 002 page : 1 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 para meter maximum rating unit power dissipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma continuous forward current 30 ma derating linear from 65 0.75 ma/ reverse voltage 5 v operating temperature range - 40 to + 80 storage temperature range - 55 to + 100 lead soldering temperature [ 2 mm(.0 787 ") from body] 260 for 5 seconds part no. : ltl1chkek - 002 page : 2 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 parameter symbol min. typ. max. unit test condition luminous intensity i v 240 680 mcd i f = 20ma note 1 viewing angle 2 1/2 45 deg note 2 (fig.5) peak emission wavelength p 632 nm measurement @peak (fig.1) dominant wavelength d 624 nm note 4 spectral line half - width ? 20 nm forward voltage v f 2.05 2.4 v i f = 20ma reverse current i r 100 a v r = 5v capacitance c 40 pf v f = 0 , f = 1mhz note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. part no. : ltl1chkek - 002 page : 3 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : ltl1chkek - 002 page : 4 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and reel. * 5mm (0.197") formed lead and 2.54mm (0.1") straight lead spacing available. * reel packaging simplifies handling and testing. package dimensions specification item symbol minim um maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of component h1 17.5 0.689 18.5 0.728 feed hole to overall component height h2 22.4 0.882 24.0 0.945 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead locat ion p1 4.4 0.173 5.8 0.228 center of component location p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape width w1 12.5 0.492 13.5 0.531 adhesive tape position w2 0 0 3. 0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl1chkek - 002 page : 5 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y packing spec 2 reel per inner carton t otal 3 000pcs per inner carton 6 inner cartons per outer carton t otal 18 000 pcs per outer carton part no. : ltl1chkek - 002 page : 6 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y bin table specification luminous intensity unit : mcd @20ma bin code min. max. jk 240 400 lm 400 680 np 680 1150 dominant wavelength unit : nm @20ma bin code min. max. h27 613.5 617.0 h28 617.0 621.0 h29 621.0 625.0 h30 625.0 629.0 h31 629.0 633.0 part no. : ltl1chkek - 002 page : 7 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their origi nal packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 5. soldering when soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. dipping the lens into the solder m ust be avoided. do not apply any external stress to the lead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre - heat pre - heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of t he led. ir reflow is not suitable process for through hole type led lamp product. part no. : ltl1chkek - 002 page : 8 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensity uniformity o n multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v character istics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices , equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between l eds during storage and handing part no. : ltl1chkek - 002 page : 9 of 11 bns - od - c131/a4 led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activa ted, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and res ult recorded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and diss ipative package materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : ltl1chkek - 002 page : 10 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classification test item test condition reference standard endurance test operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 750d:1026 (1995) mil - std - 883d:1005 (1991) jis c 7021:b - 1 (1982) high temperature high humidity storage ta= 655 c rh= 90 95% test time= 240hrs2hrs mil - std - 202f: 103b(1980) jis c 7021 : b - 11(1982) high temperature high humidity reverse bias ta= 655 c rh= 90 95% vr=5v test time = 500hrs ( - 24hrs, +48hrs) jis c 7021 : b - 11(1982) high temperat ure storage ta= 1055 c * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 883d:1008 (1991) jis c 7021:b - 10 (1982) low temperature storage ta= - 555 c * test time=1000hrs ( - 24hrs,+72hrs) jis c 7021:b - 12 (1982) environmental test temperature cycling 1 05 c 25 c - 55 c 25 c 30mins 5mins 30mins 5mins 10 cycles mil - std - 202f:107d (1980) mil - std - 750d:1051(1995) mil - std - 883d:1010 (1991) jis c 7021: a - 4(1982) thermal shock 105 5 c - 55 c 5 c 10mins 10mins 10 cycles mil - std - 202 f:107d(1980) mil - std - 750d:1051(1995) mil - std - 883d:1011 (1991) solder resistance t.sol = 260 c max dwell time= 5 secs max mil - std - 202f:210a(1980) mil - std - 750d:2031(1995) jis c 7021: a - 1(1982) solderability t. sol = 230 5 c dwell time= 5 1se cs mil - std - 202f:208d(1980) mil - std - 750d:2026(1995) mil - std - 883d:2003(1991) jis c 7021: a - 2(1982) 9. others the appearance and specifications of the product may be modified for improvement, without prior notice. part no. : ltl1chkek - 00 2 page : 11 of 11 bns - od - c131/a4

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